MemTest86 V9.2 Pro Build: 2000
PassMark Software
www.passmark.com

Memory summary:
Number of RAM slots: 8
Number of RAM modules: 4
Number of RAM SPDs detected: 4
Total Physical Memory: 65259M

SPD Details:
--------------

SPD #: 1
==============
RAM Type: DDR4
  Maximum Clock Speed (MHz): 1801 (XMP)
  Maximum Transfer Speed (MHz): DDR4-3603
  Maximum Bandwidth (MB/s): PC4-28800
Memory Capacity (MB): 16384
Jedec Manufacture Name: Crucial Technology
SPD Revision: 1.1
Registered: No
ECC: No
DIMM Slot #: 1
Manufactured: Week 27 of Year 2021
Module Part #: BL16G36C16U4BL.M16FE
Module Revision: 0x0000
Module Serial #: 0xE5F1D130
Module Manufacturing Location: 0x00
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 10 12 13 14 15 16 17 18 19 20 
Timings @ Max Frequency (JEDEC): 19-19-19-43
  Maximum Clock Speed (MHz): 1333
  Maximum Transfer Speed (MHz): DDR4-2666
  Maximum Bandwidth (MB/s): PC4-21300
  Minimum Clock Cycle Time, tCK (ns): 0.750
  Minimum CAS Latency Time, tAA (ns): 14.250
  Minimum RAS to CAS Delay, tRCD (ns): 14.250
  Minimum Row Precharge Time, tRP (ns): 14.250
  Minimum Active to Precharge Time, tRAS (ns): 32.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 3.000
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.250
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000
DDR4 Specific SPD Attributes
  Maximum Clock Cycle Time, tCKmax (ns): 1.600
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.000
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900
  Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000
  Minimum Four Activate Window Delay (ns): 21.000
  Maximum Activate Window in units of tREFI: 8192
  Thermal Sensor Present: Yes
  DRAM Stepping: 0
  DRAM Manufacture: Micron Technology
  SDRAM Package Type: Monolithic, 1 die, Single load stack
  Maxium Activate Count (MAC): Unlimited MAC
  Post Package Repair Supported: No
  Module Type: UDIMM
  Module Height (mm): 31 - 32
  Module Thickness (mm): front 1-2 , back 1-2
  Reference Raw Card Used: Raw Card B Rev. 19
XMP Enthusiast / Certified Profile (Revision: 2.0)
  Module voltage: 1.350V
  Clock speed (MHz): 1801
  Transfer Speed (MHz): DDR4-3603
  Bandwidth (MB/s): PC4-28800
  Minimum clock cycle time, tCK (ns): 0.555
  Supported CAS latencies: 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 
  Minimum CAS latency time, tAA (ns): 8.750
  Minimum RAS to CAS delay time, tRCD (ns): 9.875
  Minimum row precharge time, tRP (ns): 9.875
  Minimum active to precharge time, tRAS (ns): 21.000
  Supported timing at highest clock speed: 16-18-18-38
  Minimum Active to Auto-Refresh Delay, tRC (ns): 32.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC1 (ns): 350.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Four Activate Window Delay, tFAW (ns): 21.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.000
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.875

SPD #: 2
==============
RAM Type: DDR4
  Maximum Clock Speed (MHz): 1801 (XMP)
  Maximum Transfer Speed (MHz): DDR4-3603
  Maximum Bandwidth (MB/s): PC4-28800
Memory Capacity (MB): 16384
Jedec Manufacture Name: Crucial Technology
SPD Revision: 1.1
Registered: No
ECC: No
DIMM Slot #: 2
Manufactured: Week 27 of Year 2021
Module Part #: BL16G36C16U4BL.M16FE
Module Revision: 0x0000
Module Serial #: 0xE5F1D4CB
Module Manufacturing Location: 0x00
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 10 12 13 14 15 16 17 18 19 20 
Timings @ Max Frequency (JEDEC): 19-19-19-43
  Maximum Clock Speed (MHz): 1333
  Maximum Transfer Speed (MHz): DDR4-2666
  Maximum Bandwidth (MB/s): PC4-21300
  Minimum Clock Cycle Time, tCK (ns): 0.750
  Minimum CAS Latency Time, tAA (ns): 14.250
  Minimum RAS to CAS Delay, tRCD (ns): 14.250
  Minimum Row Precharge Time, tRP (ns): 14.250
  Minimum Active to Precharge Time, tRAS (ns): 32.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 3.000
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.250
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000
DDR4 Specific SPD Attributes
  Maximum Clock Cycle Time, tCKmax (ns): 1.600
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.000
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900
  Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000
  Minimum Four Activate Window Delay (ns): 21.000
  Maximum Activate Window in units of tREFI: 8192
  Thermal Sensor Present: Yes
  DRAM Stepping: 0
  DRAM Manufacture: Micron Technology
  SDRAM Package Type: Monolithic, 1 die, Single load stack
  Maxium Activate Count (MAC): Unlimited MAC
  Post Package Repair Supported: No
  Module Type: UDIMM
  Module Height (mm): 31 - 32
  Module Thickness (mm): front 1-2 , back 1-2
  Reference Raw Card Used: Raw Card B Rev. 19
XMP Enthusiast / Certified Profile (Revision: 2.0)
  Module voltage: 1.350V
  Clock speed (MHz): 1801
  Transfer Speed (MHz): DDR4-3603
  Bandwidth (MB/s): PC4-28800
  Minimum clock cycle time, tCK (ns): 0.555
  Supported CAS latencies: 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 
  Minimum CAS latency time, tAA (ns): 8.750
  Minimum RAS to CAS delay time, tRCD (ns): 9.875
  Minimum row precharge time, tRP (ns): 9.875
  Minimum active to precharge time, tRAS (ns): 21.000
  Supported timing at highest clock speed: 16-18-18-38
  Minimum Active to Auto-Refresh Delay, tRC (ns): 32.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC1 (ns): 350.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Four Activate Window Delay, tFAW (ns): 21.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.000
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.875

SPD #: 3
==============
RAM Type: DDR4
  Maximum Clock Speed (MHz): 1801 (XMP)
  Maximum Transfer Speed (MHz): DDR4-3603
  Maximum Bandwidth (MB/s): PC4-28800
Memory Capacity (MB): 16384
Jedec Manufacture Name: Crucial Technology
SPD Revision: 1.1
Registered: No
ECC: No
DIMM Slot #: 3
Manufactured: Week 27 of Year 2021
Module Part #: BL16G36C16U4BL.M16FE
Module Revision: 0x0000
Module Serial #: 0xE5F1D44D
Module Manufacturing Location: 0x00
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 10 12 13 14 15 16 17 18 19 20 
Timings @ Max Frequency (JEDEC): 19-19-19-43
  Maximum Clock Speed (MHz): 1333
  Maximum Transfer Speed (MHz): DDR4-2666
  Maximum Bandwidth (MB/s): PC4-21300
  Minimum Clock Cycle Time, tCK (ns): 0.750
  Minimum CAS Latency Time, tAA (ns): 14.250
  Minimum RAS to CAS Delay, tRCD (ns): 14.250
  Minimum Row Precharge Time, tRP (ns): 14.250
  Minimum Active to Precharge Time, tRAS (ns): 32.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 3.000
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.250
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000
DDR4 Specific SPD Attributes
  Maximum Clock Cycle Time, tCKmax (ns): 1.600
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.000
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900
  Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000
  Minimum Four Activate Window Delay (ns): 21.000
  Maximum Activate Window in units of tREFI: 8192
  Thermal Sensor Present: Yes
  DRAM Stepping: 0
  DRAM Manufacture: Micron Technology
  SDRAM Package Type: Monolithic, 1 die, Single load stack
  Maxium Activate Count (MAC): Unlimited MAC
  Post Package Repair Supported: No
  Module Type: UDIMM
  Module Height (mm): 31 - 32
  Module Thickness (mm): front 1-2 , back 1-2
  Reference Raw Card Used: Raw Card B Rev. 19
XMP Enthusiast / Certified Profile (Revision: 2.0)
  Module voltage: 1.350V
  Clock speed (MHz): 1801
  Transfer Speed (MHz): DDR4-3603
  Bandwidth (MB/s): PC4-28800
  Minimum clock cycle time, tCK (ns): 0.555
  Supported CAS latencies: 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 
  Minimum CAS latency time, tAA (ns): 8.750
  Minimum RAS to CAS delay time, tRCD (ns): 9.875
  Minimum row precharge time, tRP (ns): 9.875
  Minimum active to precharge time, tRAS (ns): 21.000
  Supported timing at highest clock speed: 16-18-18-38
  Minimum Active to Auto-Refresh Delay, tRC (ns): 32.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC1 (ns): 350.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Four Activate Window Delay, tFAW (ns): 21.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.000
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.875

SPD #: 4
==============
RAM Type: DDR4
  Maximum Clock Speed (MHz): 1801 (XMP)
  Maximum Transfer Speed (MHz): DDR4-3603
  Maximum Bandwidth (MB/s): PC4-28800
Memory Capacity (MB): 16384
Jedec Manufacture Name: Crucial Technology
SPD Revision: 1.1
Registered: No
ECC: No
DIMM Slot #: 4
Manufactured: Week 27 of Year 2021
Module Part #: BL16G36C16U4BL.M16FE
Module Revision: 0x0000
Module Serial #: 0xE5F1D450
Module Manufacturing Location: 0x00
# of Row Addressing Bits: 16
# of Column Addressing Bits: 10
# of Banks: 16
# of Ranks: 2
Device Width in Bits: 8
Bus Width in Bits: 64
Module Voltage: 1.2V
CAS Latencies Supported: 10 12 13 14 15 16 17 18 19 20 
Timings @ Max Frequency (JEDEC): 19-19-19-43
  Maximum Clock Speed (MHz): 1333
  Maximum Transfer Speed (MHz): DDR4-2666
  Maximum Bandwidth (MB/s): PC4-21300
  Minimum Clock Cycle Time, tCK (ns): 0.750
  Minimum CAS Latency Time, tAA (ns): 14.250
  Minimum RAS to CAS Delay, tRCD (ns): 14.250
  Minimum Row Precharge Time, tRP (ns): 14.250
  Minimum Active to Precharge Time, tRAS (ns): 32.000
  Minimum Row Active to Row Active Delay, tRRD (ns): 3.000
  Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns): 46.250
  Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns): 350.000
DDR4 Specific SPD Attributes
  Maximum Clock Cycle Time, tCKmax (ns): 1.600
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.000
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.900
  Minimum CAS to CAS Delay Time same bank group, tCCD_Lmin (ns): 5.000
  Minimum Four Activate Window Delay (ns): 21.000
  Maximum Activate Window in units of tREFI: 8192
  Thermal Sensor Present: Yes
  DRAM Stepping: 0
  DRAM Manufacture: Micron Technology
  SDRAM Package Type: Monolithic, 1 die, Single load stack
  Maxium Activate Count (MAC): Unlimited MAC
  Post Package Repair Supported: No
  Module Type: UDIMM
  Module Height (mm): 31 - 32
  Module Thickness (mm): front 1-2 , back 1-2
  Reference Raw Card Used: Raw Card B Rev. 19
XMP Enthusiast / Certified Profile (Revision: 2.0)
  Module voltage: 1.350V
  Clock speed (MHz): 1801
  Transfer Speed (MHz): DDR4-3603
  Bandwidth (MB/s): PC4-28800
  Minimum clock cycle time, tCK (ns): 0.555
  Supported CAS latencies: 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 
  Minimum CAS latency time, tAA (ns): 8.750
  Minimum RAS to CAS delay time, tRCD (ns): 9.875
  Minimum row precharge time, tRP (ns): 9.875
  Minimum active to precharge time, tRAS (ns): 21.000
  Supported timing at highest clock speed: 16-18-18-38
  Minimum Active to Auto-Refresh Delay, tRC (ns): 32.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC1 (ns): 350.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC2 (ns): 260.000
  Minimum Auto-Refresh to Active/Auto-Refresh Delay, tRFC4 (ns): 160.000
  Minimum Four Activate Window Delay, tFAW (ns): 21.000
  Minimum Activate to Activate Delay diff. bank group, tRRD_Smin (ns): 3.000
  Minimum Activate to Activate Delay same bank group, tRRD_Lmin (ns): 4.875

SMBIOS Details:
--------------

DIMM #: 1
==============
Total Width: 72 bits
Data Width: 64 bits
Size: 16384 MB
Form Factor: DIMM
Device Set: 0
Device Locator: CPU1_DIMM_A1
Bank Locator: NODE 1
Memory Type: DDR4
Type Detail: Synchronous
Speed: 3600 MT/s
Manufacturer: 
Serial Number: 
Asset Tag: 
Part Number: 
Attributes: 00000002
Configured Memory Speed: 3600 MT/s
Minimum Voltage: 1200 mV
Maximum Voltage: 1200 mV
Configured Voltage: 1200 mV
Memory Technology: Unknown
Memory Operating Mode Capability: Unknown
Firmware Version: 
Module Manufacturer ID: N/A
Module Product ID: N/A
Memory Subsystem Controller Manufacturer ID: N/A
Memory Subsystem Controller Product ID: N/A
Non Volatile Size: N/A
Volatile Size: N/A
Cache Size: N/A
Logical Size: N/A

DIMM #: 2
==============
Empty slot

DIMM #: 3
==============
Total Width: 72 bits
Data Width: 64 bits
Size: 16384 MB
Form Factor: DIMM
Device Set: 0
Device Locator: CPU1_DIMM_B1
Bank Locator: NODE 1
Memory Type: DDR4
Type Detail: Synchronous
Speed: 3600 MT/s
Manufacturer: 
Serial Number: 
Asset Tag: 
Part Number: 
Attributes: 00000002
Configured Memory Speed: 3600 MT/s
Minimum Voltage: 1200 mV
Maximum Voltage: 1200 mV
Configured Voltage: 1200 mV
Memory Technology: Unknown
Memory Operating Mode Capability: Unknown
Firmware Version: 
Module Manufacturer ID: N/A
Module Product ID: N/A
Memory Subsystem Controller Manufacturer ID: N/A
Memory Subsystem Controller Product ID: N/A
Non Volatile Size: N/A
Volatile Size: N/A
Cache Size: N/A
Logical Size: N/A

DIMM #: 4
==============
Empty slot

DIMM #: 5
==============
Total Width: 72 bits
Data Width: 64 bits
Size: 16384 MB
Form Factor: DIMM
Device Set: 0
Device Locator: CPU1_DIMM_C1
Bank Locator: NODE 1
Memory Type: DDR4
Type Detail: Synchronous
Speed: 3600 MT/s
Manufacturer: 
Serial Number: 
Asset Tag: 
Part Number: 
Attributes: 00000002
Configured Memory Speed: 3600 MT/s
Minimum Voltage: 1200 mV
Maximum Voltage: 1200 mV
Configured Voltage: 1200 mV
Memory Technology: Unknown
Memory Operating Mode Capability: Unknown
Firmware Version: 
Module Manufacturer ID: N/A
Module Product ID: N/A
Memory Subsystem Controller Manufacturer ID: N/A
Memory Subsystem Controller Product ID: N/A
Non Volatile Size: N/A
Volatile Size: N/A
Cache Size: N/A
Logical Size: N/A

DIMM #: 6
==============
Empty slot

DIMM #: 7
==============
Total Width: 72 bits
Data Width: 64 bits
Size: 16384 MB
Form Factor: DIMM
Device Set: 0
Device Locator: CPU1_DIMM_D1
Bank Locator: NODE 1
Memory Type: DDR4
Type Detail: Synchronous
Speed: 3600 MT/s
Manufacturer: 
Serial Number: 
Asset Tag: 
Part Number: 
Attributes: 00000002
Configured Memory Speed: 3600 MT/s
Minimum Voltage: 1200 mV
Maximum Voltage: 1200 mV
Configured Voltage: 1200 mV
Memory Technology: Unknown
Memory Operating Mode Capability: Unknown
Firmware Version: 
Module Manufacturer ID: N/A
Module Product ID: N/A
Memory Subsystem Controller Manufacturer ID: N/A
Memory Subsystem Controller Product ID: N/A
Non Volatile Size: N/A
Volatile Size: N/A
Cache Size: N/A
Logical Size: N/A

DIMM #: 8
==============
Empty slot