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Hi
My system always show Disk error"Test file could not be re-opened" while running burnin test.
(Pretty much in 15-20 minutes)
I can still duplicate this symptom after anti-virus software been uninstalled.
Is there any method I can check which driver cause this error?
Besides, when I uninstall audio driver, this error can not be duplicated easily(it need to run burnin test over 22 hours)
But when the audio driver is installed, it usually happened in one hour.
I wonder if this test procedure can prove this error message related to audio driver?
Thanks!
PassMark BurnInTest Log file - http://www.passmark.com
================================================== ======
Date: Mon Sep 19 08:10:17 2016
BurnInTest V8.1 Pro 1018 (64-bit)
System summary:
Windows 10 Professional Edition build 14393 (64-bit),
1 x Intel(R) Core(TM) i7-7500U CPU @ 2.70GHz [3495.5 MHz],
7.9GB RAM,
Intel(R) HD Graphics 620, AMD Radeon(TM) R7 M440,
119GB SSD,
CD-RW/DVDRW,
General:
System Name: LAPTOP-FPUE7JKT
System Model: HP Notebook
Motherboard Manufacturer: HP
Motherboard Name: 81EE
Motherboard Version: 62.28
Motherboard Serial Number: PXXXXA4MY9TB9N
BIOS Manufacturer: HPQOEM - 0
BIOS Release Date: 2016/09/07
BIOS Serial Number: CND55160RK
CPU:
CPU manufacturer: GenuineIntel
CPU Type: Intel(R) Core(TM) i7-7500U CPU @ 2.70GHz
CPUID: Family 6, Model 8E, Stepping 9
Physical CPU's: 1
Cores per CPU: 2
Hyperthreading: Enabled
CPU features: MMX SSE SSE2 SSE3 SSSE3 SSE4.1 SSE4.2 DEP PAE Intel64 VMX AES AVX AVX2 XOP FMA3
Clock frequencies:
- Measured CPU speed: 3495.5 MHz
Cache per CPU package:
- L1 Instruction Cache: 4 x 32 KB
- L1 data cache: 4 x 32 KB
- L2 cache: 4 x 256 KB
- L3 cache: 4 MB
Memory
Total Physical Memory: 8109MB
Available Physical Memory: 6593MB
Memory devices:
DIMM 1:
- 4GB DDR4 SDRAM PC4-17000
- Samsung M471A5143EB0-CPB, wk/yr: 9/2016
- 1.2V, Clk: 1066.7MHz, Timings 15-15-15-36 (@ Max. freq.)
DIMM 2:
- 4GB DDR4 SDRAM PC4-17000
- Hynix Semiconductor (Hyundai Electronics) HMA451S6AFR8N-TF, serial#: 1898088916, wk/yr: 52/2015
- 1.2V, Clk: 1066.7MHz, Timings 15-15-15-36 (@ Max. freq.)
Virtual memory: C:\pagefile.sys (allocated base size 8704MB)
Memory SPD:
DIMM#0
Memory type: DDR4 SDRAM
SPD revision: 1.1
Manufacturer: Samsung
Manufacturing date: Year: 2016, Week: 9
Serial number: 923631D6
Part number: M471A5143EB0-CPB
Clock speed: 1066.7 MHz
Memory size: 4096 MB
Number of banks: 16
Row address bits: 15
Column address bits: 10
Bus width: 64 bits
Device width: 8 bits
Number of ranks: 1
ECC: No
Module voltage: 1.2V
Minimum clock cycle time (tCK): 0.938 ns
Supported CAS latencies: 10 11 12 13 14 15 16
Minimum CAS latency time (tAA): 13.750 ns
Minimum RAS to CAS delay time (tRCD): 13.750 ns
Minimum row precharge time (tRP): 13.750 ns
Minimum active to precharge time (tRAS): 33.000 ns
Supported timing at highest clock speed: 15-15-15-36
Minimum Row Active to Row Active Delay (tRRD): 3.700 ns
Minimum Active to Auto-Refresh Delay (tRC): 46.750 ns
Minimum Recovery Delay (tRFC): 260.000 ns
Maximum clock cycle time (tCKmax): 1.600 ns
Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 160.000 ns
Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 110.000 ns
Minimum Activate to Activate Delay Time (tRRD_Smin), different 3.700 ns
Minimum Activate to Activate Delay Time (tRRD_Lmin), same bank 5.300 ns
Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank group: 5.355 ns
Minimum Four Activate Window Delay (tFAW): 21.000 ns
Maximum Activate Window in units of tREFI (tMAW): 8192
Thermal Sensor present: No
DRAM manufacture name: Samsung
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair supported: No
Module type: SO-DIMM
Module Height: 29 - 30 mm
Module Thickness: Front: 1 - 2 mm, Back: 1 - 2 mm
Reference raw card used: Raw Card A Rev. 15
DIMM#1
Memory type: DDR4 SDRAM
SPD revision: 1.0
Manufacturer: Hynix Semiconductor (Hyundai Electronics)
Manufacturing date: Year: 2015, Week: 52
Serial number: 712289D4
Part number: HMA451S6AFR8N-TF
Clock speed: 1066.7 MHz
Memory size: 4096 MB
Number of banks: 16
Row address bits: 15
Column address bits: 10
Bus width: 64 bits
Device width: 8 bits
Number of ranks: 1
ECC: No
Module voltage: 1.2V
Minimum clock cycle time (tCK): 0.938 ns
Supported CAS latencies: 9 11 12 13 14 15 16
Minimum CAS latency time (tAA): 13.500 ns
Minimum RAS to CAS delay time (tRCD): 13.500 ns
Minimum row precharge time (tRP): 13.500 ns
Minimum active to precharge time (tRAS): 33.000 ns
Supported timing at highest clock speed: 15-15-15-36
Minimum Row Active to Row Active Delay (tRRD): 3.700 ns
Minimum Active to Auto-Refresh Delay (tRC): 46.500 ns
Minimum Recovery Delay (tRFC): 260.000 ns
Maximum clock cycle time (tCKmax): 1.500 ns
Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 160.000 ns
Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 110.000 ns
Minimum Activate to Activate Delay Time (tRRD_Smin), different 3.700 ns
Minimum Activate to Activate Delay Time (tRRD_Lmin), same bank 5.300 ns
Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank group: 5.628 ns
Minimum Four Activate Window Delay (tFAW): 21.000 ns
Maximum Activate Window in units of tREFI (tMAW): 8192
Thermal Sensor present: No
DRAM Stepping: 255
DRAM manufacture name: Hynix Semiconductor (Hyundai Electronics)
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair supported: No
Module type: SO-DIMM
Module Height: 29 - 30 mm
Module Thickness: Front: 1 - 2 mm, Back: 1 - 2 mm
Reference raw card used: Raw Card A Rev. 15
Graphics
Intel(R) HD Graphics 620
Chip Type: Intel(R) HD Graphics Family
DAC Type: Internal
Memory: 1024MB
BIOS: Intel Video BIOS
Driver provider: Intel Corporation
Driver version: 21.20.16.4506
Driver date: 8-19-2016
Monitor 1: 1366x768x32 60Hz (Primary monitor)
AMD Radeon(TM) R7 M440
Memory: 0MB
Disk volumes
C: Local Drive, \\?\Volume{c8fceb08-68a7-4d95-bfe9-38153f0c9ada}\, Windows, NTFS, (118.01GB total, 79.79GB free)
D: Optical drive, \\?\Volume{a9145b06-7e63-11e6-9454-806e6f6e6963}\
Disk drives
Disk drive: Model: SAMSUNG MZNLF128HCHP-000H1 Serial: S2HUNXAGB20900 (Disk: 0, Size: 119.24GB, Volumes: C)
Optical drives
D: hp DVDRW GUD0N (CD-RW/DVDRW)
Network
Realtek RTL8188EE 802.11 bgn Wi-Fi Adapter (MAC: 68:14:01:3F:07:6B)
Realtek PCIe FE Family Controller (MAC: A0:8C:FD:82:07:4A)
Ports
Keyboard Port: PS/2 connector
Mouse Port: PS/2 connector
USB
USB xHCI Compliant Host Controller
******************
DETAILED EVENT LOG
******************
LOG NOTE: 2016-09-19 08:10:17, Status, PassMark BurnInTest V8.1 Pro 1018 (64-bit)
LOG NOTE: 2016-09-19 08:10:19, Status, Main Tests started
LOG NOTE: 2016-09-19 08:10:19, CPU, SSE4a test(s) selected, but CPU feature not detected
LOG NOTE: 2016-09-19 08:10:20, 3D Graphics, 3D test starting: Duty cycle = 100. Test on primary monitor (0). (x,y) = (310,0). WxH = 300x200.
LOG NOTE: 2016-09-19 08:10:23, Video, Video test starting: Duty cycle = 100. Test on primary monitor (0). (x,y) = (310,400). WxH = 300x200.
LOG NOTE: 2016-09-19 08:23:41, Disk , Deletion failed: C:\BurnInTest test files\~bittestC00062
LOG NOTE: 2016-09-19 08:23:41, Disk, The process cannot access the file because it is being used by another process. (32)
WARNING: 2016-09-19 08:30:16, Disk, C: Test file could not be created. Check access privileges.
LOG NOTE: 2016-09-19 08:30:16, Disk, Write block - File name: C:\BurnInTest test files\~bittestC00018
LOG NOTE: 2016-09-19 08:30:16, Disk, The process cannot access the file because it is being used by another process. (32)
WARNING: 2016-09-19 08:30:16, Disk, C: Test file could not be re-opened
LOG NOTE: 2016-09-19 08:30:16, Disk, File block that could not be opened was: C:\BurnInTest test files\~bittestC00018
LOG NOTE: 2016-09-19 08:30:23, Disk, Disk Error (C
: Test file could not be re-opened in Cycle 79 with pattern Random data, random seeking
INFORMATION: 2016-09-19 09:09:44, Disk, C: Butterfly seeking skipped for this disk (SSD/NVMe)
LOG NOTE: 2016-09-19 09:33:28, Status, Test run stopped
**************
RESULT SUMMARY
**************
Test Start time: Mon Sep 19 08:10:18 2016
Test Stop time: Mon Sep 19 09:33:28 2016
Test Duration: 001h 23m 10s
Temperature HDD 0 (SAMSUNG MZNLF128HCHP-000H1) (Min/Current/Max): 28.0C / 58.0C / 58.0C
Test Name Cycles Operations Result Errors Last Error
CPU 318 7.022 Trillion PASS 0 No errors
Memory (RAM) 79 949 Billion PASS 0 No errors
2D Graphics 3651 985799 PASS 0 No errors
3D Graphics 12 367891 PASS 0 No errors
Temperature - - PASS 0 No errors
Sound 27 92.886 Million PASS 0 No errors
Video Playback 107 1369 PASS 0 No errors
Disk (C 294 850 Billion FAIL 2 Test file could not be re-opened
Network 1 96 3.848 Million PASS 0 No errors
TEST RUN FAILED
*******************************************
SERIOUS ERROR SUMMARY FOR THE LAST TEST RUN
*******************************************
-----------------------------------------------------------------------------------------------------
My system always show Disk error"Test file could not be re-opened" while running burnin test.
(Pretty much in 15-20 minutes)
I can still duplicate this symptom after anti-virus software been uninstalled.
Is there any method I can check which driver cause this error?
Besides, when I uninstall audio driver, this error can not be duplicated easily(it need to run burnin test over 22 hours)
But when the audio driver is installed, it usually happened in one hour.
I wonder if this test procedure can prove this error message related to audio driver?
Thanks!
PassMark BurnInTest Log file - http://www.passmark.com
================================================== ======
Date: Mon Sep 19 08:10:17 2016
BurnInTest V8.1 Pro 1018 (64-bit)
System summary:
Windows 10 Professional Edition build 14393 (64-bit),
1 x Intel(R) Core(TM) i7-7500U CPU @ 2.70GHz [3495.5 MHz],
7.9GB RAM,
Intel(R) HD Graphics 620, AMD Radeon(TM) R7 M440,
119GB SSD,
CD-RW/DVDRW,
General:
System Name: LAPTOP-FPUE7JKT
System Model: HP Notebook
Motherboard Manufacturer: HP
Motherboard Name: 81EE
Motherboard Version: 62.28
Motherboard Serial Number: PXXXXA4MY9TB9N
BIOS Manufacturer: HPQOEM - 0
BIOS Release Date: 2016/09/07
BIOS Serial Number: CND55160RK
CPU:
CPU manufacturer: GenuineIntel
CPU Type: Intel(R) Core(TM) i7-7500U CPU @ 2.70GHz
CPUID: Family 6, Model 8E, Stepping 9
Physical CPU's: 1
Cores per CPU: 2
Hyperthreading: Enabled
CPU features: MMX SSE SSE2 SSE3 SSSE3 SSE4.1 SSE4.2 DEP PAE Intel64 VMX AES AVX AVX2 XOP FMA3
Clock frequencies:
- Measured CPU speed: 3495.5 MHz
Cache per CPU package:
- L1 Instruction Cache: 4 x 32 KB
- L1 data cache: 4 x 32 KB
- L2 cache: 4 x 256 KB
- L3 cache: 4 MB
Memory
Total Physical Memory: 8109MB
Available Physical Memory: 6593MB
Memory devices:
DIMM 1:
- 4GB DDR4 SDRAM PC4-17000
- Samsung M471A5143EB0-CPB, wk/yr: 9/2016
- 1.2V, Clk: 1066.7MHz, Timings 15-15-15-36 (@ Max. freq.)
DIMM 2:
- 4GB DDR4 SDRAM PC4-17000
- Hynix Semiconductor (Hyundai Electronics) HMA451S6AFR8N-TF, serial#: 1898088916, wk/yr: 52/2015
- 1.2V, Clk: 1066.7MHz, Timings 15-15-15-36 (@ Max. freq.)
Virtual memory: C:\pagefile.sys (allocated base size 8704MB)
Memory SPD:
DIMM#0
Memory type: DDR4 SDRAM
SPD revision: 1.1
Manufacturer: Samsung
Manufacturing date: Year: 2016, Week: 9
Serial number: 923631D6
Part number: M471A5143EB0-CPB
Clock speed: 1066.7 MHz
Memory size: 4096 MB
Number of banks: 16
Row address bits: 15
Column address bits: 10
Bus width: 64 bits
Device width: 8 bits
Number of ranks: 1
ECC: No
Module voltage: 1.2V
Minimum clock cycle time (tCK): 0.938 ns
Supported CAS latencies: 10 11 12 13 14 15 16
Minimum CAS latency time (tAA): 13.750 ns
Minimum RAS to CAS delay time (tRCD): 13.750 ns
Minimum row precharge time (tRP): 13.750 ns
Minimum active to precharge time (tRAS): 33.000 ns
Supported timing at highest clock speed: 15-15-15-36
Minimum Row Active to Row Active Delay (tRRD): 3.700 ns
Minimum Active to Auto-Refresh Delay (tRC): 46.750 ns
Minimum Recovery Delay (tRFC): 260.000 ns
Maximum clock cycle time (tCKmax): 1.600 ns
Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 160.000 ns
Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 110.000 ns
Minimum Activate to Activate Delay Time (tRRD_Smin), different 3.700 ns
Minimum Activate to Activate Delay Time (tRRD_Lmin), same bank 5.300 ns
Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank group: 5.355 ns
Minimum Four Activate Window Delay (tFAW): 21.000 ns
Maximum Activate Window in units of tREFI (tMAW): 8192
Thermal Sensor present: No
DRAM manufacture name: Samsung
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair supported: No
Module type: SO-DIMM
Module Height: 29 - 30 mm
Module Thickness: Front: 1 - 2 mm, Back: 1 - 2 mm
Reference raw card used: Raw Card A Rev. 15
DIMM#1
Memory type: DDR4 SDRAM
SPD revision: 1.0
Manufacturer: Hynix Semiconductor (Hyundai Electronics)
Manufacturing date: Year: 2015, Week: 52
Serial number: 712289D4
Part number: HMA451S6AFR8N-TF
Clock speed: 1066.7 MHz
Memory size: 4096 MB
Number of banks: 16
Row address bits: 15
Column address bits: 10
Bus width: 64 bits
Device width: 8 bits
Number of ranks: 1
ECC: No
Module voltage: 1.2V
Minimum clock cycle time (tCK): 0.938 ns
Supported CAS latencies: 9 11 12 13 14 15 16
Minimum CAS latency time (tAA): 13.500 ns
Minimum RAS to CAS delay time (tRCD): 13.500 ns
Minimum row precharge time (tRP): 13.500 ns
Minimum active to precharge time (tRAS): 33.000 ns
Supported timing at highest clock speed: 15-15-15-36
Minimum Row Active to Row Active Delay (tRRD): 3.700 ns
Minimum Active to Auto-Refresh Delay (tRC): 46.500 ns
Minimum Recovery Delay (tRFC): 260.000 ns
Maximum clock cycle time (tCKmax): 1.500 ns
Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 160.000 ns
Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 110.000 ns
Minimum Activate to Activate Delay Time (tRRD_Smin), different 3.700 ns
Minimum Activate to Activate Delay Time (tRRD_Lmin), same bank 5.300 ns
Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank group: 5.628 ns
Minimum Four Activate Window Delay (tFAW): 21.000 ns
Maximum Activate Window in units of tREFI (tMAW): 8192
Thermal Sensor present: No
DRAM Stepping: 255
DRAM manufacture name: Hynix Semiconductor (Hyundai Electronics)
SDRAM Package Type: Monolithic, 1 die, Single load stack
Maxium Activate Count (MAC): Unlimited MAC
Post Package Repair supported: No
Module type: SO-DIMM
Module Height: 29 - 30 mm
Module Thickness: Front: 1 - 2 mm, Back: 1 - 2 mm
Reference raw card used: Raw Card A Rev. 15
Graphics
Intel(R) HD Graphics 620
Chip Type: Intel(R) HD Graphics Family
DAC Type: Internal
Memory: 1024MB
BIOS: Intel Video BIOS
Driver provider: Intel Corporation
Driver version: 21.20.16.4506
Driver date: 8-19-2016
Monitor 1: 1366x768x32 60Hz (Primary monitor)
AMD Radeon(TM) R7 M440
Memory: 0MB
Disk volumes
C: Local Drive, \\?\Volume{c8fceb08-68a7-4d95-bfe9-38153f0c9ada}\, Windows, NTFS, (118.01GB total, 79.79GB free)
D: Optical drive, \\?\Volume{a9145b06-7e63-11e6-9454-806e6f6e6963}\
Disk drives
Disk drive: Model: SAMSUNG MZNLF128HCHP-000H1 Serial: S2HUNXAGB20900 (Disk: 0, Size: 119.24GB, Volumes: C)
Optical drives
D: hp DVDRW GUD0N (CD-RW/DVDRW)
Network
Realtek RTL8188EE 802.11 bgn Wi-Fi Adapter (MAC: 68:14:01:3F:07:6B)
Realtek PCIe FE Family Controller (MAC: A0:8C:FD:82:07:4A)
Ports
Keyboard Port: PS/2 connector
Mouse Port: PS/2 connector
USB
USB xHCI Compliant Host Controller
******************
DETAILED EVENT LOG
******************
LOG NOTE: 2016-09-19 08:10:17, Status, PassMark BurnInTest V8.1 Pro 1018 (64-bit)
LOG NOTE: 2016-09-19 08:10:19, Status, Main Tests started
LOG NOTE: 2016-09-19 08:10:19, CPU, SSE4a test(s) selected, but CPU feature not detected
LOG NOTE: 2016-09-19 08:10:20, 3D Graphics, 3D test starting: Duty cycle = 100. Test on primary monitor (0). (x,y) = (310,0). WxH = 300x200.
LOG NOTE: 2016-09-19 08:10:23, Video, Video test starting: Duty cycle = 100. Test on primary monitor (0). (x,y) = (310,400). WxH = 300x200.
LOG NOTE: 2016-09-19 08:23:41, Disk , Deletion failed: C:\BurnInTest test files\~bittestC00062
LOG NOTE: 2016-09-19 08:23:41, Disk, The process cannot access the file because it is being used by another process. (32)
WARNING: 2016-09-19 08:30:16, Disk, C: Test file could not be created. Check access privileges.
LOG NOTE: 2016-09-19 08:30:16, Disk, Write block - File name: C:\BurnInTest test files\~bittestC00018
LOG NOTE: 2016-09-19 08:30:16, Disk, The process cannot access the file because it is being used by another process. (32)
WARNING: 2016-09-19 08:30:16, Disk, C: Test file could not be re-opened
LOG NOTE: 2016-09-19 08:30:16, Disk, File block that could not be opened was: C:\BurnInTest test files\~bittestC00018
LOG NOTE: 2016-09-19 08:30:23, Disk, Disk Error (C
: Test file could not be re-opened in Cycle 79 with pattern Random data, random seeking INFORMATION: 2016-09-19 09:09:44, Disk, C: Butterfly seeking skipped for this disk (SSD/NVMe)
LOG NOTE: 2016-09-19 09:33:28, Status, Test run stopped
**************
RESULT SUMMARY
**************
Test Start time: Mon Sep 19 08:10:18 2016
Test Stop time: Mon Sep 19 09:33:28 2016
Test Duration: 001h 23m 10s
Temperature HDD 0 (SAMSUNG MZNLF128HCHP-000H1) (Min/Current/Max): 28.0C / 58.0C / 58.0C
Test Name Cycles Operations Result Errors Last Error
CPU 318 7.022 Trillion PASS 0 No errors
Memory (RAM) 79 949 Billion PASS 0 No errors
2D Graphics 3651 985799 PASS 0 No errors
3D Graphics 12 367891 PASS 0 No errors
Temperature - - PASS 0 No errors
Sound 27 92.886 Million PASS 0 No errors
Video Playback 107 1369 PASS 0 No errors
Disk (C
294 850 Billion FAIL 2 Test file could not be re-openedNetwork 1 96 3.848 Million PASS 0 No errors
TEST RUN FAILED
*******************************************
SERIOUS ERROR SUMMARY FOR THE LAST TEST RUN
*******************************************
-----------------------------------------------------------------------------------------------------
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