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Error message "Test file could not be re-opened" showed while running Burnin test.

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  • Error message "Test file could not be re-opened" showed while running Burnin test.

    Hi

    My system always show Disk error"Test file could not be re-opened" while running burnin test.
    (Pretty much in 15-20 minutes)
    I can still duplicate this symptom after anti-virus software been uninstalled.
    Is there any method I can check which driver cause this error?

    Besides, when I uninstall audio driver, this error can not be duplicated easily(it need to run burnin test over 22 hours)
    But when the audio driver is installed, it usually happened in one hour.
    I wonder if this test procedure can prove this error message related to audio driver?
    Thanks!


    PassMark BurnInTest Log file - http://www.passmark.com
    ================================================== ======

    Date: Mon Sep 19 08:10:17 2016

    BurnInTest V8.1 Pro 1018 (64-bit)

    System summary:
    Windows 10 Professional Edition build 14393 (64-bit),
    1 x Intel(R) Core(TM) i7-7500U CPU @ 2.70GHz [3495.5 MHz],
    7.9GB RAM,
    Intel(R) HD Graphics 620, AMD Radeon(TM) R7 M440,
    119GB SSD,
    CD-RW/DVDRW,

    General:
    System Name: LAPTOP-FPUE7JKT
    System Model: HP Notebook
    Motherboard Manufacturer: HP
    Motherboard Name: 81EE
    Motherboard Version: 62.28
    Motherboard Serial Number: PXXXXA4MY9TB9N
    BIOS Manufacturer: HPQOEM - 0
    BIOS Release Date: 2016/09/07
    BIOS Serial Number: CND55160RK

    CPU:
    CPU manufacturer: GenuineIntel
    CPU Type: Intel(R) Core(TM) i7-7500U CPU @ 2.70GHz
    CPUID: Family 6, Model 8E, Stepping 9
    Physical CPU's: 1
    Cores per CPU: 2
    Hyperthreading: Enabled
    CPU features: MMX SSE SSE2 SSE3 SSSE3 SSE4.1 SSE4.2 DEP PAE Intel64 VMX AES AVX AVX2 XOP FMA3
    Clock frequencies:
    - Measured CPU speed: 3495.5 MHz
    Cache per CPU package:
    - L1 Instruction Cache: 4 x 32 KB
    - L1 data cache: 4 x 32 KB
    - L2 cache: 4 x 256 KB
    - L3 cache: 4 MB

    Memory
    Total Physical Memory: 8109MB
    Available Physical Memory: 6593MB
    Memory devices:
    DIMM 1:
    - 4GB DDR4 SDRAM PC4-17000
    - Samsung M471A5143EB0-CPB, wk/yr: 9/2016
    - 1.2V, Clk: 1066.7MHz, Timings 15-15-15-36 (@ Max. freq.)
    DIMM 2:
    - 4GB DDR4 SDRAM PC4-17000
    - Hynix Semiconductor (Hyundai Electronics) HMA451S6AFR8N-TF, serial#: 1898088916, wk/yr: 52/2015
    - 1.2V, Clk: 1066.7MHz, Timings 15-15-15-36 (@ Max. freq.)
    Virtual memory: C:\pagefile.sys (allocated base size 8704MB)

    Memory SPD:
    DIMM#0
    Memory type: DDR4 SDRAM
    SPD revision: 1.1
    Manufacturer: Samsung
    Manufacturing date: Year: 2016, Week: 9
    Serial number: 923631D6
    Part number: M471A5143EB0-CPB
    Clock speed: 1066.7 MHz
    Memory size: 4096 MB
    Number of banks: 16
    Row address bits: 15
    Column address bits: 10
    Bus width: 64 bits
    Device width: 8 bits
    Number of ranks: 1
    ECC: No
    Module voltage: 1.2V
    Minimum clock cycle time (tCK): 0.938 ns
    Supported CAS latencies: 10 11 12 13 14 15 16
    Minimum CAS latency time (tAA): 13.750 ns
    Minimum RAS to CAS delay time (tRCD): 13.750 ns
    Minimum row precharge time (tRP): 13.750 ns
    Minimum active to precharge time (tRAS): 33.000 ns
    Supported timing at highest clock speed: 15-15-15-36
    Minimum Row Active to Row Active Delay (tRRD): 3.700 ns
    Minimum Active to Auto-Refresh Delay (tRC): 46.750 ns
    Minimum Recovery Delay (tRFC): 260.000 ns
    Maximum clock cycle time (tCKmax): 1.600 ns
    Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 160.000 ns
    Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 110.000 ns
    Minimum Activate to Activate Delay Time (tRRD_Smin), different 3.700 ns
    Minimum Activate to Activate Delay Time (tRRD_Lmin), same bank 5.300 ns
    Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank group: 5.355 ns
    Minimum Four Activate Window Delay (tFAW): 21.000 ns
    Maximum Activate Window in units of tREFI (tMAW): 8192
    Thermal Sensor present: No
    DRAM manufacture name: Samsung
    SDRAM Package Type: Monolithic, 1 die, Single load stack
    Maxium Activate Count (MAC): Unlimited MAC
    Post Package Repair supported: No
    Module type: SO-DIMM
    Module Height: 29 - 30 mm
    Module Thickness: Front: 1 - 2 mm, Back: 1 - 2 mm
    Reference raw card used: Raw Card A Rev. 15

    DIMM#1
    Memory type: DDR4 SDRAM
    SPD revision: 1.0
    Manufacturer: Hynix Semiconductor (Hyundai Electronics)
    Manufacturing date: Year: 2015, Week: 52
    Serial number: 712289D4
    Part number: HMA451S6AFR8N-TF
    Clock speed: 1066.7 MHz
    Memory size: 4096 MB
    Number of banks: 16
    Row address bits: 15
    Column address bits: 10
    Bus width: 64 bits
    Device width: 8 bits
    Number of ranks: 1
    ECC: No
    Module voltage: 1.2V
    Minimum clock cycle time (tCK): 0.938 ns
    Supported CAS latencies: 9 11 12 13 14 15 16
    Minimum CAS latency time (tAA): 13.500 ns
    Minimum RAS to CAS delay time (tRCD): 13.500 ns
    Minimum row precharge time (tRP): 13.500 ns
    Minimum active to precharge time (tRAS): 33.000 ns
    Supported timing at highest clock speed: 15-15-15-36
    Minimum Row Active to Row Active Delay (tRRD): 3.700 ns
    Minimum Active to Auto-Refresh Delay (tRC): 46.500 ns
    Minimum Recovery Delay (tRFC): 260.000 ns
    Maximum clock cycle time (tCKmax): 1.500 ns
    Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 160.000 ns
    Minimum Auto-Refresh to Active/Auto-Refresh Command Period (tRF 110.000 ns
    Minimum Activate to Activate Delay Time (tRRD_Smin), different 3.700 ns
    Minimum Activate to Activate Delay Time (tRRD_Lmin), same bank 5.300 ns
    Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank group: 5.628 ns
    Minimum Four Activate Window Delay (tFAW): 21.000 ns
    Maximum Activate Window in units of tREFI (tMAW): 8192
    Thermal Sensor present: No
    DRAM Stepping: 255
    DRAM manufacture name: Hynix Semiconductor (Hyundai Electronics)
    SDRAM Package Type: Monolithic, 1 die, Single load stack
    Maxium Activate Count (MAC): Unlimited MAC
    Post Package Repair supported: No
    Module type: SO-DIMM
    Module Height: 29 - 30 mm
    Module Thickness: Front: 1 - 2 mm, Back: 1 - 2 mm
    Reference raw card used: Raw Card A Rev. 15


    Graphics
    Intel(R) HD Graphics 620
    Chip Type: Intel(R) HD Graphics Family
    DAC Type: Internal
    Memory: 1024MB
    BIOS: Intel Video BIOS
    Driver provider: Intel Corporation
    Driver version: 21.20.16.4506
    Driver date: 8-19-2016
    Monitor 1: 1366x768x32 60Hz (Primary monitor)
    AMD Radeon(TM) R7 M440
    Memory: 0MB

    Disk volumes
    C: Local Drive, \\?\Volume{c8fceb08-68a7-4d95-bfe9-38153f0c9ada}\, Windows, NTFS, (118.01GB total, 79.79GB free)
    D: Optical drive, \\?\Volume{a9145b06-7e63-11e6-9454-806e6f6e6963}\

    Disk drives
    Disk drive: Model: SAMSUNG MZNLF128HCHP-000H1 Serial: S2HUNXAGB20900 (Disk: 0, Size: 119.24GB, Volumes: C)

    Optical drives
    D: hp DVDRW GUD0N (CD-RW/DVDRW)

    Network
    Realtek RTL8188EE 802.11 bgn Wi-Fi Adapter (MAC: 68:14:01:3F:07:6B)
    Realtek PCIe FE Family Controller (MAC: A0:8C:FD:82:07:4A)

    Ports
    Keyboard Port: PS/2 connector
    Mouse Port: PS/2 connector

    USB
    USB xHCI Compliant Host Controller

    ******************
    DETAILED EVENT LOG
    ******************
    LOG NOTE: 2016-09-19 08:10:17, Status, PassMark BurnInTest V8.1 Pro 1018 (64-bit)
    LOG NOTE: 2016-09-19 08:10:19, Status, Main Tests started
    LOG NOTE: 2016-09-19 08:10:19, CPU, SSE4a test(s) selected, but CPU feature not detected
    LOG NOTE: 2016-09-19 08:10:20, 3D Graphics, 3D test starting: Duty cycle = 100. Test on primary monitor (0). (x,y) = (310,0). WxH = 300x200.
    LOG NOTE: 2016-09-19 08:10:23, Video, Video test starting: Duty cycle = 100. Test on primary monitor (0). (x,y) = (310,400). WxH = 300x200.
    LOG NOTE: 2016-09-19 08:23:41, Disk , Deletion failed: C:\BurnInTest test files\~bittestC00062
    LOG NOTE: 2016-09-19 08:23:41, Disk, The process cannot access the file because it is being used by another process. (32)
    WARNING: 2016-09-19 08:30:16, Disk, C: Test file could not be created. Check access privileges.
    LOG NOTE: 2016-09-19 08:30:16, Disk, Write block - File name: C:\BurnInTest test files\~bittestC00018
    LOG NOTE: 2016-09-19 08:30:16, Disk, The process cannot access the file because it is being used by another process. (32)
    WARNING: 2016-09-19 08:30:16, Disk, C: Test file could not be re-opened
    LOG NOTE: 2016-09-19 08:30:16, Disk, File block that could not be opened was: C:\BurnInTest test files\~bittestC00018
    LOG NOTE: 2016-09-19 08:30:23, Disk, Disk Error (C: Test file could not be re-opened in Cycle 79 with pattern Random data, random seeking
    INFORMATION: 2016-09-19 09:09:44, Disk, C: Butterfly seeking skipped for this disk (SSD/NVMe)
    LOG NOTE: 2016-09-19 09:33:28, Status, Test run stopped

    **************
    RESULT SUMMARY
    **************
    Test Start time: Mon Sep 19 08:10:18 2016
    Test Stop time: Mon Sep 19 09:33:28 2016
    Test Duration: 001h 23m 10s
    Temperature HDD 0 (SAMSUNG MZNLF128HCHP-000H1) (Min/Current/Max): 28.0C / 58.0C / 58.0C

    Test Name Cycles Operations Result Errors Last Error
    CPU 318 7.022 Trillion PASS 0 No errors
    Memory (RAM) 79 949 Billion PASS 0 No errors
    2D Graphics 3651 985799 PASS 0 No errors
    3D Graphics 12 367891 PASS 0 No errors
    Temperature - - PASS 0 No errors
    Sound 27 92.886 Million PASS 0 No errors
    Video Playback 107 1369 PASS 0 No errors
    Disk (C 294 850 Billion FAIL 2 Test file could not be re-opened
    Network 1 96 3.848 Million PASS 0 No errors
    TEST RUN FAILED

    *******************************************
    SERIOUS ERROR SUMMARY FOR THE LAST TEST RUN
    *******************************************

    -----------------------------------------------------------------------------------------------------

  • #2
    I think the key error is,
    "The process cannot access the file because it is being used by another process. (32)"

    There must be some 3rd party software on the machine locking the files.
    (e.g. software doing backups, syncing with the cloud, scanning for viruses, etc..)

    Comment


    • #3
      I had tried on pure OS environment without any third party software and no internet connected.
      I found UAC and Windows firewall might affect the test result.
      If I disable UAC and turn off Windows firewall, the test will fail.
      If I enable UAC and turn on Windows firewall, the test will pass.
      I'm just curious if BurnIn test related to these settings.
      Do you have any suggestion about the environment setting?

      Comment


      • #4
        Can you narrow it down to either UAC or the firewall.

        There shouldn't really be any sensitivity to either of these settings.

        Comment

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